Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere
A novel die-attach material, Cu particle paste with self-reduction and self-protection characteristics, was designed by simply adding ascorbic acid (AA) into Cu paste. The self-reduction characteristic is due to the addition of AA into the paste, as it reduces the Cu oxide layer on the metal Cu, eve...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2018-12-01
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| Series: | Materials & Design |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127518308098 |