Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size

by Chuantong Chen, Katsuaki Suganuma
Published 2019-01-01

Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors

by Seungjun Noh, Hao Zhang, Katsuaki Suganuma
Published 2018-12-01

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

by Chanyang Choe, Chuantong Chen, Seungjun Noh, Katsuaki Suganuma
Published 2018-11-01

Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints

by Peng Xue, Weiliang Liang, Peng He, Katsuaki Suganuma, Hao Zhang
Published 2019-04-01

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

by Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen, Katsuaki Suganuma
Published 2019-10-01

Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

by Fu-Long Sun, Zhi-Quan Liu, Cai-Fu Li, Qing-Sheng Zhu, Hao Zhang, Katsuaki Suganuma
Published 2018-02-01

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

by Yue Gao, Wanli Li, Chuantong Chen, Hao Zhang, Jinting Jiu, Cai-Fu Li, Shijo Nagao, Katsuaki Suganuma
Published 2018-12-01

The Surface Coating of Commercial LiFePO4 by Utilizing ZIF-8 for High Electrochemical Performance Lithium Ion Battery

by XiaoLong Xu, CongYu Qi, ZhenDong Hao, Hao Wang, JinTing Jiu, JingBing Liu, Hui Yan, Katsuaki Suganuma
Published 2017-09-01