Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

by Fu-Long Sun, Zhi-Quan Liu, Cai-Fu Li, Qing-Sheng Zhu, Hao Zhang, Katsuaki Suganuma
Published 2018-02-01

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

by Yue Gao, Wanli Li, Chuantong Chen, Hao Zhang, Jinting Jiu, Cai-Fu Li, Shijo Nagao, Katsuaki Suganuma
Published 2018-12-01

Association between oral health-related quality of life and depressive symptoms in Chinese college students: Fitness Improvement Tactics in Youths (FITYou) project

by Zheng Zhang, Ying Tian, Fei Zhong, Cai-fu Li, Shu-mei Dong, Yan Huang, Xing-er Liu, Cong Huang
Published 2019-06-01