Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

by Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen, Katsuaki Suganuma
Published 2019-10-01

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

by Yue Gao, Wanli Li, Chuantong Chen, Hao Zhang, Jinting Jiu, Cai-Fu Li, Shijo Nagao, Katsuaki Suganuma
Published 2018-12-01