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Seungjun Noh
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Seungjun Noh
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Seungjun Noh
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1
Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors
by
Seungjun
Noh
,
Hao Zhang
,
Katsuaki Suganuma
Published 2018-12-01
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Article
2
Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
by
Chanyang Choe
,
Chuantong Chen
,
Seungjun
Noh
,
Katsuaki Suganuma
Published 2018-11-01
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