Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure
In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated, and the effects of powder types were compared. The paramete...
| Main Authors: | , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-03-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/11/3/328 |