An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons inclu...

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Bibliographic Details
Main Authors: Romit Kulkarni, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger, André Zimmermann
Format: Article
Language:English
Published: MDPI AG 2019-02-01
Series:Journal of Manufacturing and Materials Processing
Subjects:
encapsulation
electronics
manufacturing
thermoset
epoxy molding compound
EMC
injection molding
resistors
QFN
board level package
surface mount technology
SMT
SMD
transfer molding
injection molding simulation
flow simulation
reliability
PCB
Online Access:https://www.mdpi.com/2504-4494/3/1/18

Internet

https://www.mdpi.com/2504-4494/3/1/18

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