An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

by Romit Kulkarni, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger, André Zimmermann
Published 2019-02-01

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

by Romit Kulkarni, Mahdi Soltani, Peter Wappler, Thomas Guenther, Karl-Peter Fritz, Tobias Groezinger, André Zimmermann
Published 2020-03-01

Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding

by Thomas Guenther, Lars Diegel, Marcel Roeder, Marc Drexler, Mehmet Haybat, Peter Wappler, Mahdi Soltani, André Zimmermann
Published 2020-06-01