A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

by Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, Andre Zimmermann
Published 2019-01-01

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

by Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, André Zimmermann
Published 2018-12-01

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB

by Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, Andre Zimmermann
Published 2018-01-01

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

by Romit Kulkarni, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger, André Zimmermann
Published 2019-02-01

Open-Eco-Innovation for SMEs with Pan-European Key Enabling Technology Centres

by Faruk Civelek, Romit Kulkarni, Karl-Peter Fritz, Tanja Meyer, Costas Troulos, Thomas Guenther, André Zimmermann
Published 2020-10-01

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

by Romit Kulkarni, Mahdi Soltani, Peter Wappler, Thomas Guenther, Karl-Peter Fritz, Tobias Groezinger, André Zimmermann
Published 2020-03-01