<b>The Realization of Redistribution Layers for FOWLP by Inkjet Printing </b>

<b>The Realization of Redistribution Layers for FOWLP by Inkjet Printing </b>

The implementation of additive manufacturing technology (e.g., digital printing) to the electronic packaging segment has recently received increasing attention. In almost all types of Fan-out wafer level packaging (FOWLP), redistribution layers (RDLs) are formed by a combination of photolithography,...

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Bibliographic Details
Main Authors: Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Format: Article
Language:English
Published: MDPI AG 2018-12-01
Series:Proceedings
Subjects:
MEMS packaging
inkjet printing
fan-out wafer level packaging
rdl
rapid prototyping
Online Access:https://www.mdpi.com/2504-3900/2/13/703

Internet

https://www.mdpi.com/2504-3900/2/13/703

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