3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping

by Matic Krivec, Ali Roshanghias, Alfred Binder
Published 2017-08-01

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

by Johanna Zikulnig, Ali Roshanghias, Lukas Rauter, Christina Hirschl
Published 2020-04-01

Analysis of Single- and Double Core Planar Fluxgate Structures

by Neosha Navaei, Ali Roshanghias, Martin Lenzhofer, Michael Ortner
Published 2018-12-01

<b>The Realization of Redistribution Layers for FOWLP by Inkjet Printing </b>

by Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Published 2018-12-01

MWCNT–Epoxy Nanocomposite Sensors for Structural Health Monitoring

by Omid Sam-Daliri, Lisa-Marie Faller, Mohammadreza Farahani, Ali Roshanghias, Hannes Oberlercher, Tobias Mitterer, Alireza Araee, Hubert Zangl
Published 2018-08-01

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

by Ali Roshanghias, Perla Malago, Jaroslaw Kaczynski, Timothy Polom, Jochen Bardong, Dominik Holzmann, Muhammad-Hassan Malik, Michael Ortner, Christina Hirschl, Alfred Binder
Published 2021-04-01

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

by Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, Martin Schneider-Ramelow
Published 2020-05-01