<b>The Realization of Redistribution Layers for FOWLP by Inkjet Printing </b>

by Ali Roshanghias, Ying Ma, Marc Dreissigacker, Tanja Braun, Christian Bretthauer, Karl-F. Becker, Martin Schneider-Ramelow
Published 2018-12-01

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

by Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow
Published 2019-05-01

Hydroxychloroquine in patients with inflammatory and erosive osteoarthritis of the hands: results of the OA-TREAT study—a randomised, double-blind, placebo-controlled, multicentre,...

by Frank Buttgereit, Joachim Listing, Claudia Kedor, Jacqueline Detert, Rolf Rau, Siegfried Wassenberg, Tanja Braun, Pascal Klaus, Walter Hermann, Stefan Markus Weiner
Published 2021-08-01

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

by Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F. Becker, Sven Rzepka, Martin Schneider-Ramelow
Published 2020-05-01

Sustained Increase of 25-Hydroxyvitamin D Levels in Healthy Young Women during Wintertime after Three Suberythemal UV Irradiations-The MUVY Pilot Study.

by Maria Gudrun Biersack, Malgorzata Hajdukiewicz, Ralf Uebelhack, Leonora Franke, Helmut Piazena, Pascal Klaus, Vera Höhne-Zimmer, Tanja Braun, Frank Buttgereit, Gerd-Rüdiger Burmester, Jacqueline Detert
Published 2016-01-01