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  1. 61
    Near infrared colorants with individualized rasters on drug packaging
    Subjects: “...drug packaging...”
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    Article
  2. 62
    NICPRINT-50, Being some account of the history of the printing, packaging and newspaper industry of South Africa, and of the National Industrial Council for Printing, prepared to mark the Jubilee of the Council 1919-1969
    by Picton, L J
    Published 2018
    “...The National Industrial Council of the Printing and Newspaper Industry of South Africa celebrates...”
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    Dissertation
  3. 63
    Characterization of Glass Insulating Thick Films with Ag Conductors for Multilayer Packages
    by Jun Fang, Renli Fu, Xiguang Gu, Xinyao Zhang, Guojun Li
    Published 2021-01-01
    Subjects: “...screen-print...”
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    Article
  4. 64
    INFLUENCE OF VARIOUS RAW MATERIAL AND TECHNOLOGICAL REGIMES OF ITS RECYCLING ON QUALITATIVE INDICES OF SEMI-FINISHED PRODUCT USED FOR PACKAGE PRINTING
    by V. V. Kuzmich
    Published 2014-08-01
    Subjects: “...packaging...”
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    Article
  5. 65
    Mechanical characterization and modeling of solder joints for the secondary side reflow of large IC packages
    by Yutzie, James D.
    Published 2012
    Subjects: “...Printed circuits -- Design and construction...”
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  6. 66
    An automated system for measuring PWB/PWBA warpage during simulation of the infrared reflow and wave soldering processes, and during operational thermal cycling
    by Stiteler, Michael Ross
    Published 2007
    Subjects: “...Printed circuits...”
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  7. 67
    Investigating the Marketing Strategy of Packaging and Printing Industry from the Perspective of SWOT and Buyer Utility Matrix – The Case of A Company
    by LIN, YA-TING, 林雅婷
    Published 2018
    “... market, inflationary pulp commodity, and domestic consuming power in recession, packaging and printing...”
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    Others
  8. 68
    Encapsulation of Fiber Optic Sensors in 3D Printed Packages for Use in Civil Engineering Applications: A Preliminary Study
    Subjects: “...3D printing...”
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    Article
  9. 69
    A Comprehensive Framework for Open Innovation Adoption at firm level (Case: A Firm in Food Packaging and Printing Industry)
    Subjects: “...open innovation knowledge capacity inoovation process food packaging and printing...”
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    Article
  10. 70
    Detection of Lard in Ink Extracted from Printed Food Packaging Using Fourier Transform Infrared Spectroscopy and Multivariate Analysis
    “... to discriminate the presence of lard in extracted ink of printed food packaging. Two spectral regions (full...”
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    Article
  11. 71
    Environmental Impact Assessment of Flexible Package Printing with the “LUNAJET<sup>®</sup>” Aqueous Inkjet Ink Using Nanodispersion Technology
    Subjects: “...flexible package...”
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    Article
  12. 72
    The Investigation on the Manufacturing Process of a Printed Circuit Board Digital Package Based Small Direct Methanol Fuel Cell
    by Chia-Hao Chang, 張家豪
    Published 2006
    “... digital package is a novel manufacturing and assembly process, and there are very limited literatures...”
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    Others
  13. 73
    On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
    Subjects: “...microelectromechanical systems (MEMS) packaging...”
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    Article
  14. 74
    Titanium Dioxide Nanotube-Based Oxygen Indicator for Modified Atmosphere Packaging: Efficiency and Accuracy
    Subjects: “...screen-printing method...”
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    Article
  15. 75
    Effect of ink and paper characteristics on optical properties of packaging papers.Part II:Viscosity of ink 50-55
    Subjects: “...Printing...”
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    Article
  16. 76
    Printed RFID Humidity Sensor Tags for Flexible Smart Systems
    by Feng, Yi
    Published 2015
    Subjects: “...Intelligent packaging...”
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    Doctoral Thesis
  17. 77
    VO<sub>2</sub>(B)/Graphene Composite-Based Symmetrical Supercapacitor Electrode via Screen Printing for Intelligent Packaging
    Subjects: “...screen printing...”
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    Article
  18. 78
    Analytical thermal resistance model for calculating mean die temperature of eccentric quad flat no-leads packaging on printed circuit board
    “... for calculating the mean die temperature of eccentric QFN packaging on the printed circuit board (PCB...”
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    Article
  19. 79
    Fabrication of Micro-Punch Array by Plasma Printing for Micro-Embossing into Copper Substrates
    Subjects: “...packaging...”
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    Article
  20. 80
    Evaluation of Reliefs’ Properties on Design of Thermoformed Packaging Using Fused Deposition Modelling Moulds
    Subjects: “...packaging design...”
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    Article
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