Suggested Topics within your search.
Showing 1 - 20 results of 1,507 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.04s Refine Results
  1. 1
    The Thermal Analysis of Integrated Circuit Package
    by Yi-Chen Yen, 嚴逸塵
    Published 2000
    “...碩士 === 國立成功大學 === 機械工程學系 === 88 === The packaging process is very important in the semiconductor...”
    Get full text
    Others
  2. 2
    The Integrated Circuit Packaging Scheduling Problem
    by Chiao-Yi Chen, 陳巧頤
    Published 2000
    “...碩士 === 國立交通大學 === 工業工程與管理系 === 88 === The integrated circuit packaging scheduling problem (ICPSP...”
    Get full text
    Others
  3. 3
    ELECTRICAL CHARACTERISTICS OF INTEGRATED CIRCUIT PACKAGES
    by Senthinathan, Ramesh, 1961-
    Published 1987
    Subjects: “...Integrated circuits....”
    Get full text
  4. 4
    Inspection of Packaged Integrated Circuits using Terahertz Radiation
    by Andreas Fritz, Thomas Arnold
    Published 2014-12-01
    Subjects: “...terahertz; Time domain spectroscopy; Wavelet transformation; Wavelet denosing; packaged integrated...”
    Get full text
    Article
  5. 5
    Design and research of the bandwidth enhanced circuits for wire bonding in integrated circuit packaging
    by Huang Sheng Kai, 黃聖凱
    Published 2011
    “... systems and tend to make high-frequency circuit applications, as well as integrated circuit packaging...”
    Get full text
    Others
  6. 6
    Multiscale EM and circuit simulation using the Laguerre-FDTD scheme for package-aware integrated-circuit design
    by Srinivasan, Gopikrishna
    Published 2008
    Subjects: “...Integrated circuits Design and construction...”
    Get full text
  7. 7
    Design and implementation of an integrated VLSI packaging support software environment
    by Whipple, Thomas Driggs, 1961-
    Published 1989
    Subjects: “...Integrated circuits -- Simulation methods....”
    Get full text
    Get full text
  8. 8
    Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
    Subjects: “...photonic integrated circuits (PICs)...”
    Get full text
    Article
  9. 9
    Process Evaluation and Improvement Model of Semiconductor Integrated Circuit Packaging
    by Shih-chang Huang, 黃世章
    Published 2018
    “... integrated with the features of large capacity, high bandwidth, low power consumption, and miniaturization...”
    Get full text
    Others
  10. 10
    Multiwire microstrip interconnects for high-frequency integrated circuit packaging
    by Cafaro, Nicholas Giovanni, Jr.
    Published 2007
    Subjects: “...Wire bonding (Electronic packaging)...”
    Get full text
  11. 11
    Dual gate microwave devices and technologies of integrated circuits packaging
    by Ping-Lin Chen, 陳柄霖
    Published 2000
    “...,we probe into the popular package technology──Ball Grid Array . And we also probe into how the BGA...”
    Get full text
    Others
  12. 12
    Electrical Modeling of Integrated-Circuit Packages Using Electromagnetic Methods
    by 何承諭
    Published 2004
    Get full text
    Others
  13. 13
    Wettability of low Sn solders on integrated circuit package metallizations
    by Gabriel, Michelle Wendy
    Published 2008
    Get full text
    Others
  14. 14
    Modeling and Minimization of Integrated Circuit Packaging Parasitics at Radio Frequencies
    by Benedik, Christopher
    Published 2013
    Subjects: “...integrated circuit packaging...”
    Get full text
  15. 15
    The effect of die attach voiding on the thermal resistance of integrated circuit package
    by Chang, Li-hsin, 1946-
    Published 1987
    Subjects: “...Integrated circuits -- Design....”
    Get full text
  16. 16
    Materials research on metallized aluminum-nitride for microelectronic packaging
    by Newberg, Carl Edward, 1962-
    Published 1988
    Subjects: “...Integrated circuits -- Materials -- Electric properties....”
    Get full text
  17. 17
    Model extraction of a paddle in plastic surface-mount RF-IC packages
    by Sundberg, Garth
    Published 2012
    Subjects: “...Integrated circuits -- Packaging...”
    Get full text
  18. 18
    Analysis domain truncation of interconnections in multilayer packaging structures
    by Garg, Nitin Kumar, 1967-
    Published 1989
    Subjects: “...Integrated circuits....”
    Get full text
  19. 19
    Phase Change Materials for Thermal Management of IC Packages
    by P. Fiala, I. Behunek
    Published 2007-06-01
    Subjects: “...integrated circuit...”
    Get full text
    Article
  20. 20
    Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages
    by Konstantin O. Petrosyants, Nikita I. Ryabov
    Published 2020-06-01
    Subjects: “...LSI packages...”
    Get full text
    Article
Search Tools: Get RSS Feed — Email this Search