Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

by Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, Cormac Eason, Padraic Morrissey, Marc Rensing, Sean Collins, How Yuan Hwang, Peter O’Brien
Published 2016-12-01