Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

by Lee Carroll, Jun-Su Lee, Carmelo Scarcella, Kamil Gradkowski, Matthieu Duperron, Huihui Lu, Yan Zhao, Cormac Eason, Padraic Morrissey, Marc Rensing, Sean Collins, How Yuan Hwang, Peter O’Brien
Published 2016-12-01

Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

by How Yuan Hwang, Jun Su Lee, Tae Joon Seok, Alex Forencich, Hannah R. Grant, Dylan Knutson, Niels Quack, Sangyoon Han, Richard S. Muller, George C. Papen, Ming C. Wu, Peter O'Brien
Published 2017-01-01