A Defect-Tolerant Multi-TSV Structure and Placement for Power-Grids in 3D ICs
碩士 === 國立彰化師範大學 === 電子工程學系 === 105 === The TSV(Through-Silicon Via, TSV) is a passage between chip and chip in 3D-IC.TSVs can be classified as power TSV, data TSV and clock TSV.TSV is easily aged or failed by noise, thermal or electromagnetic effects. Especially, when the TSV is bearing huge current...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/667c28 |