The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET

碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 103 === For the continuing scaled down of the device’s size, many problems will be encountered such as short channel effect, random dopant fluctuation, and leakage currents. Several of these problems have been handled well in advanced CMOS technology. Among these,...

Full description

Bibliographic Details
Main Authors: Wu, Chia-Wei, 吳嘉偉
Other Authors: Chung, Shao-Shiun
Format: Others
Language:en_US
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/86954388498297361375
id ndltd-TW-103NCTU5428171
record_format oai_dc
spelling ndltd-TW-103NCTU54281712016-08-14T04:11:21Z http://ndltd.ncl.edu.tw/handle/86954388498297361375 The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET 淺溝渠隔離氧化層對三維閘極電晶體的可靠性影響 Wu, Chia-Wei 吳嘉偉 碩士 國立交通大學 電子工程學系 電子研究所 103 For the continuing scaled down of the device’s size, many problems will be encountered such as short channel effect, random dopant fluctuation, and leakage currents. Several of these problems have been handled well in advanced CMOS technology. Among these, the trigate structure has been considered to be the candidate for the future generations. Trigate MOSFET has better gate controllability to solve the short channel effect. It also has immunity from the random dopant fluctuation because of the lightly doped channel. However, trigate devices also suffer from another problems such as side wall surface roughness, metal work function variation, and self-heating effect etc. The trigate device needs to be thoroughly studied for the future design and applications. Since the fin width is getting thinner, the STI (shallow trench isolation) are closer to the channel region, and it might have some impacts on that. In this thesis, we propose a new method to characterize the STI traps under the fin channel. Under the long term NBTI stress, the standard deviation of threshold voltage will change and by using the trigate depletion model we proposed, we can easily find the distribution of these traps under the channel region. The second part, we apply the technique to examine the radiation induced random STI traps. It is known that the X-ray will have an influence on STI traps. As the size of MOSFET shrinks down, the gate oxide is becoming so thin. However the STI oxide cannot become as thin as the gate oxide, so there are still some problems when exposing under the radiations. In the previous studies that were mainly focusing on the nuclear models or the effects of different kinds of radiations. We first combined the reliability test with the X-ray. After being exposed to the radiations, the trigate devices were then taken to the NBTI testing. The pre X-ray irradiated procedure affects the reliability a lot due to the massively increased STI traps. The on current of the device will be degraded and threshold voltage will increase due to the increased STI traps near the channel region. This result is helpful to the design of the future devices especially in the space technology. Chung, Shao-Shiun 莊紹勳 2015 學位論文 ; thesis 81 en_US
collection NDLTD
language en_US
format Others
sources NDLTD
description 碩士 === 國立交通大學 === 電子工程學系 電子研究所 === 103 === For the continuing scaled down of the device’s size, many problems will be encountered such as short channel effect, random dopant fluctuation, and leakage currents. Several of these problems have been handled well in advanced CMOS technology. Among these, the trigate structure has been considered to be the candidate for the future generations. Trigate MOSFET has better gate controllability to solve the short channel effect. It also has immunity from the random dopant fluctuation because of the lightly doped channel. However, trigate devices also suffer from another problems such as side wall surface roughness, metal work function variation, and self-heating effect etc. The trigate device needs to be thoroughly studied for the future design and applications. Since the fin width is getting thinner, the STI (shallow trench isolation) are closer to the channel region, and it might have some impacts on that. In this thesis, we propose a new method to characterize the STI traps under the fin channel. Under the long term NBTI stress, the standard deviation of threshold voltage will change and by using the trigate depletion model we proposed, we can easily find the distribution of these traps under the channel region. The second part, we apply the technique to examine the radiation induced random STI traps. It is known that the X-ray will have an influence on STI traps. As the size of MOSFET shrinks down, the gate oxide is becoming so thin. However the STI oxide cannot become as thin as the gate oxide, so there are still some problems when exposing under the radiations. In the previous studies that were mainly focusing on the nuclear models or the effects of different kinds of radiations. We first combined the reliability test with the X-ray. After being exposed to the radiations, the trigate devices were then taken to the NBTI testing. The pre X-ray irradiated procedure affects the reliability a lot due to the massively increased STI traps. The on current of the device will be degraded and threshold voltage will increase due to the increased STI traps near the channel region. This result is helpful to the design of the future devices especially in the space technology.
author2 Chung, Shao-Shiun
author_facet Chung, Shao-Shiun
Wu, Chia-Wei
吳嘉偉
author Wu, Chia-Wei
吳嘉偉
spellingShingle Wu, Chia-Wei
吳嘉偉
The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET
author_sort Wu, Chia-Wei
title The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET
title_short The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET
title_full The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET
title_fullStr The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET
title_full_unstemmed The Impact of the Shallow Trench Isolation on the Reliability of Trigate MOSFET
title_sort impact of the shallow trench isolation on the reliability of trigate mosfet
publishDate 2015
url http://ndltd.ncl.edu.tw/handle/86954388498297361375
work_keys_str_mv AT wuchiawei theimpactoftheshallowtrenchisolationonthereliabilityoftrigatemosfet
AT wújiāwěi theimpactoftheshallowtrenchisolationonthereliabilityoftrigatemosfet
AT wuchiawei qiǎngōuqúgélíyǎnghuàcéngduìsānwéizhájídiànjīngtǐdekěkàoxìngyǐngxiǎng
AT wújiāwěi qiǎngōuqúgélíyǎnghuàcéngduìsānwéizhájídiànjīngtǐdekěkàoxìngyǐngxiǎng
AT wuchiawei impactoftheshallowtrenchisolationonthereliabilityoftrigatemosfet
AT wújiāwěi impactoftheshallowtrenchisolationonthereliabilityoftrigatemosfet
_version_ 1718375774241685504