Using the Taguchi Method Experimental Analysis of Electrostatic Chuck(ESC) from Wafer Process to Improve the Offset Parameter Optimization Study

• Main Authors: Yen Kun-Zhi, 顏堃至
• Other Authors: Ming-Tzer Lin
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/95397418553353372156

碩士 === 國立中興大學 === 精密工程學系所 === 103 === In the wafer fabrication process, there is a need for the wafer to be restrain within the chamber, the most common practice is the usage of electrostatic chuck (ESC) to hold the wafer. ESC makes use of the static energy between the wafer & chuck to hold the wafer, the principles is to apply voltage to the chuck electrode, causing the chuck to produce static energy,resulting in a chucking force between the wafer & ESC surface thus holding the wafer stationary. After wafer processing is completed, applying a reverse polarity voltage will neutralize the wafer surface static load, attaining fast chucking release and wafer processing throughput. If the polarity voltage switching is not optimized, there is a tendency of wafer scratch, drag & even wafer broken. This will not only increase the manufacturing process and cost, but also reduce the ESC lifetime. This paperisafter theprocessis completed, ESC duringdechuck step usingTaguchi Method to tuning variable parameter, after that dothe experimentaldataanalysisto reduce abnormal wafer pick up afterwafer processis completed. So can achieveproduction equipmentstability, reduce product lossand minimize cost.