Using the Taguchi Method Experimental Analysis of Electrostatic Chuck(ESC) from Wafer Process to Improve the Offset Parameter Optimization Study

碩士 === 國立中興大學 === 精密工程學系所 === 103 === In the wafer fabrication process, there is a need for the wafer to be restrain within the chamber, the most common practice is the usage of electrostatic chuck (ESC) to hold the wafer. ESC makes use of the static energy between the wafer & chuck to hold the...

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Bibliographic Details
Main Authors: Yen Kun-Zhi, 顏堃至
Other Authors: Ming-Tzer Lin
Format: Others
Language:zh-TW
Published: 2015
Online Access:http://ndltd.ncl.edu.tw/handle/95397418553353372156