Study on Soldering Reaction between Sn-Cu Solder and Ni UBMs: Prevention of Spalling, Control of Texture, and Modification of Growth of Intermetallics
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 101 === In the field of modern electronic packaging, the three-dimensional integrated circuit (3D IC) packaging has become essential for the microelectronics industry. Under the continuing development of 3D IC packaging, solder micro bumping is regarded as the most...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96880915653743313386 |