Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure

by Y.S. Chiu, C.R. Kao, A. Shigetou
Published 2020-10-01

Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing

by H.T. Hung, P.T. Lee, C.H. Tsai, C.R. Kao
Published 2020-11-01

Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5

by Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Yu-Hsuan Huang, Ching-Yu Chiang, Ching-Shun Ku, C.R. Kao, Cheng-En Ho
Published 2021-07-01

Experimental Investigation of the Si-Ge-Ti Ternary Phase Diagram and Diffusion Behaviors

by Jain, T. A., 簡廷安
Published 1998

A Study on the Phase Equilibria and Interface Reactions between Nickel and Bismuth for Lead-Free Solders Applications

by Lee, M. S., 李明勳
Published 1998

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

by Wen-Tai Chen, 陳文泰
Published 2002

Electromigration effect on the microstructure of Tin foil

by wen-Hisang Wang, 王祥文
Published 2002

THE GOLD-EMBRITTLEMENT PHENOMENON IN ADVANCED ELECTRONIC PACKAGES AND ITS PREVENTION

by Cheng-En Ho, 何政恩
Published 2002

Electromigration Induced Microstructure change in Flip Chip Solders Joint and Tin Stripe

by Ying-Chiang Hu, 胡應強
Published 2004

Interfacial reaction between NiCu alloyand Sn3Ag solder

by Jer-Min Chang, 張哲銘
Published 2005

The diffusion of Cu in the molten eutectic Sn-pb solder with electromigration

by Huamg-Wei Su, 蘇皇維
Published 2005

Cross-Interaction of Ni and Cu in Sn

by Quei-Pin Li, 李魁斌
Published 2005

The Effects of the Solder Composition on Interfacial Reactions in Flip-Chip Solder Joints

by Chih-Chiang Chang, 張智強
Published 2010

Grain Boundary Penetration of Various Types of Ni layersby Molten Pb and PbSn alloy

by Chia-Yuan Chang, 張珈源
Published 2012

金濃度對球矩陣構裝銲點剪力強度影響之研究

by A. H. Lin, 林安宏
Published 2001

A Study on the Phase Equilibria and Diffusion Behaviors in the Ni-Si-Ge system at 750℃

by C. S. Huang, 黃建盛
Published 1999

Interfacial Reactions between Ni Substrate and Microelectronics BiSn Solder

by Chi Chen, 陳琪
Published 1999

Experimental investigation of the Si-Ge-Co ternary phase diagram and diffusion reactions

by Chang -Gi -Huang, 黃成吉
Published 1999

Critical Issues in Soldering Reactions Arising from Space Confinement in 3D IC Packages

by Hsin-Yi Chuang, 莊鑫毅
Published 2012

Study on Soldering Reaction between Sn-Cu Solder and Ni UBMs: Prevention of Spalling, Control of Texture, and Modification of Growth of Intermetallics

by Wei-Ming Chen, 陳偉銘
Published 2012