EBSD Characterization of Intermetallic Layers in Cu/Al Joint under HTST and HAST Reliability Tests
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 101 === Wire bonding is a key technique to provide electrical interconnections between integrated circuit(IC) chips and lead frames in microelectronics. Gold is the most popular interconnection material in wire bonding, due to cost savings and better electrical an...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44j533 |