Efficient TSV Planning Algorithm via Congestion-Aware Block Shifting in 3D Floorplanning
碩士 === 國立交通大學 === 電子研究所 === 100 === With the development of integration technology, 3D integrated technology has been proposed in recent years. Compared to the 2D integration technology, 3D integration technology stacks multiple dies to form a 3D structure and the through-silicon vias (TSVs) are uti...
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15796298955023137401 |