The Thermo-Mechanical Effects of Lead and Lead-Free Solder Alloys on the WLCSP Packages
碩士 === 明新科技大學 === 精密機電工程研究所 === 97 === The removal of lead (Pb) from electronic products necessitates the replacement of the classical eutectic Sn-Pb solder by an adequate material. Among alternative lead-free solders the Sn-Ag/Sn-Ag-Cu materials seem to have the most promise as lead-free solder...
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| Format: | Others |
| Language: | zh-TW |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55527538364217986249 |