Showing 1 - 9 results of 9 for search '蔡新春', query time: 0.06s Refine Results
  1. 1
    同倫數值法解非線性系統的根及在兩點邊界值問題上之應用
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  2. 2
    Investigations on the Reliability Assessment of Lead-Free Packages Subjected to Temperature Cyclic Loading
    by Hsin-Chun Tsai, 蔡新春
    Published 2006
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  3. 3
    Investigations on the Thermo-Mechanical Characteristics of Solder Joint with a Polymer Reinforced Wafer Level Package
    by 翁嘉濬
    Published 2012
    Other Authors: “...蔡新春...”
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  4. 4
    The Effects of Ramp Rate on the Cracked Lead-free Solder in IC Packages Subjected to Temperature Cyclic Loading
    by 陳宗希
    Published 2011
    Other Authors: “...蔡新春...”
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  5. 5
    The Effects of Ramp Rate and Dwell Time on CCGA1657 Package with Lead-free Solder Joints
    by 傅義羽
    Published 2011
    Other Authors: “...蔡新春...”
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  6. 6
    The Thermo-Mechanical Effects of Lead and Lead-Free Solder Alloys on the WLCSP Packages
    by 辛震
    Published 2009
    Other Authors: “...蔡新春...”
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  7. 7
    Fatigue Life Predictions of the Lead-Free Solder Joints on High-Density PBGA Packages
    by 黃苑洛
    Published 2009
    Other Authors: “...蔡新春...”
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  8. 8
    The Mechanical Characteristics of Polymer Collar/Core and Hollow Solder Ball in Wafer Level Packages
    by Hsin-Chi Chang, 張信基
    Published 2014
    Other Authors: “...蔡新春...”
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  9. 9
    Comparison of Inelastic Behaviors of Solder Jointin the Polymer Reinforced Wafer Level Package
    by Hsieh yu chang, 謝譽瑺
    Published 2013
    Other Authors: “...蔡新春...”
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