Zn Concentration Effet on the Interfacial Reaction between Lead-Free Solders and Cu.
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 95 === The acute Zn concentration sensitivity of the reaction between Sn-based solders and Cu substrate is reported and explained in this paper. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt. %) were reacted with Cu substrates at 250oC for 2-10 mins. A slight variat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43889647669543677714 |