Showing 1 - 5 results of 5 for search '鄭紹良, 高振宏', query time: 0.08s Refine Results
  1. 1
    Study of intermetallic growth in Mg-Ni diffusion couples
    by Ming-hong Jhou, 周明弘
    Published 2007
    Other Authors: “...鄭紹良, 高振宏...”
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  2. 2
    The Main Diffusing Species in Cu-Sn Intermetallic Compounds
    by Cheng-Han Chung, 鍾承翰
    Published 2007
    Other Authors: “...鄭紹良, 高振宏...”
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  3. 3
    Dissolution and Interfacial Reaction between Cu and Sn-Ag-Cu Solders
    by Chih-Chiang Chang, 張智強
    Published 2007
    Other Authors: “...鄭紹良, 高振宏...”
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  4. 4
    Zn Concentration Effet on the Interfacial Reaction between Lead-Free Solders and Cu.
    by Su-Chun Yang, 楊素純
    Published 2007
    Other Authors: “...鄭紹良, 高振宏...”
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  5. 5
    The Effects of Minor Fe, Co, and Ni addition to Lead-Free Solders on the Thickness of Cu3Sn at the Interface
    by Yi-wun Wang, 王儀雯
    Published 2007
    Other Authors: “...鄭紹良, 高振宏...”
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