Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === The thermo-mechanical properties of two bisphenol resin-based underfill materials including coefficient of thermal expansion (CTE), glass transition temperature (Tg), hardness (H), Young’s modulus (E), flexure modulus (Ef) and adhesion (Gc) were measured and va...
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ndltd-TW-094NCTU51590722016-05-27T04:18:55Z http://ndltd.ncl.edu.tw/handle/33430087621072073702 Reliability Studies of Novel Underfill Materials for Flip-chip Packaging 新穎底部填膠材料對覆晶封裝可靠度之研究 徐元辰 碩士 國立交通大學 材料科學與工程系所 94 The thermo-mechanical properties of two bisphenol resin-based underfill materials including coefficient of thermal expansion (CTE), glass transition temperature (Tg), hardness (H), Young’s modulus (E), flexure modulus (Ef) and adhesion (Gc) were measured and validated against vendor’s data by differential scanning calorimetry (DSC), thermomechanical analyzer (TMA), nanoindentation (NI), four-point bend (4PT Bending) and double cantilever beam (DCB), respectively. Underfill properties data were then used as the input for calculating the stresses at the bump and Cu-low-k structure two-dimensional finite-elements-method (FEM) simulation by ANSYSTM in order to predict the loci of potential failure and identify critical properties of underfill. Excellent correlation was established between the temperature cycling test (TCT) and stress simulation results. The results show that for high lead solder, underfill with low CTE and high modulus is preferred. Finally, the methodologies for characterizing thin-film adhesion such as four-point bending(4PT) and double cantilever beam(DCB) for measuring the fracture energy of interconnect and underfill/passivation interface were reported in this study. Jihperng(Jim) Leu 呂志鵬 2006 學位論文 ; thesis 77 zh-TW |
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碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === The thermo-mechanical properties of two bisphenol resin-based underfill materials including coefficient of thermal expansion (CTE), glass transition temperature (Tg), hardness (H), Young’s modulus (E), flexure modulus (Ef) and adhesion (Gc) were measured and validated against vendor’s data by differential scanning calorimetry (DSC), thermomechanical analyzer (TMA), nanoindentation (NI), four-point bend (4PT Bending) and double cantilever beam (DCB), respectively.
Underfill properties data were then used as the input for calculating the stresses
at the bump and Cu-low-k structure two-dimensional finite-elements-method (FEM) simulation by ANSYSTM in order to predict the loci of potential failure and identify critical properties of underfill.
Excellent correlation was established between the temperature cycling test (TCT) and stress simulation results. The results show that for high lead solder, underfill with low CTE and high modulus is preferred.
Finally, the methodologies for characterizing thin-film adhesion such as four-point bending(4PT) and double cantilever beam(DCB) for measuring the fracture energy of interconnect and underfill/passivation interface were reported in this study.
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author2 |
Jihperng(Jim) Leu |
author_facet |
Jihperng(Jim) Leu 徐元辰 |
author |
徐元辰 |
spellingShingle |
徐元辰 Reliability Studies of Novel Underfill Materials for Flip-chip Packaging |
author_sort |
徐元辰 |
title |
Reliability Studies of Novel Underfill Materials for Flip-chip Packaging |
title_short |
Reliability Studies of Novel Underfill Materials for Flip-chip Packaging |
title_full |
Reliability Studies of Novel Underfill Materials for Flip-chip Packaging |
title_fullStr |
Reliability Studies of Novel Underfill Materials for Flip-chip Packaging |
title_full_unstemmed |
Reliability Studies of Novel Underfill Materials for Flip-chip Packaging |
title_sort |
reliability studies of novel underfill materials for flip-chip packaging |
publishDate |
2006 |
url |
http://ndltd.ncl.edu.tw/handle/33430087621072073702 |
work_keys_str_mv |
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