Reliability Studies of Novel Underfill Materials for Flip-chip Packaging

碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === The thermo-mechanical properties of two bisphenol resin-based underfill materials including coefficient of thermal expansion (CTE), glass transition temperature (Tg), hardness (H), Young’s modulus (E), flexure modulus (Ef) and adhesion (Gc) were measured and va...

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Main Author: 徐元辰
Other Authors: Jihperng(Jim) Leu
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/33430087621072073702
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spelling ndltd-TW-094NCTU51590722016-05-27T04:18:55Z http://ndltd.ncl.edu.tw/handle/33430087621072073702 Reliability Studies of Novel Underfill Materials for Flip-chip Packaging 新穎底部填膠材料對覆晶封裝可靠度之研究 徐元辰 碩士 國立交通大學 材料科學與工程系所 94 The thermo-mechanical properties of two bisphenol resin-based underfill materials including coefficient of thermal expansion (CTE), glass transition temperature (Tg), hardness (H), Young’s modulus (E), flexure modulus (Ef) and adhesion (Gc) were measured and validated against vendor’s data by differential scanning calorimetry (DSC), thermomechanical analyzer (TMA), nanoindentation (NI), four-point bend (4PT Bending) and double cantilever beam (DCB), respectively. Underfill properties data were then used as the input for calculating the stresses at the bump and Cu-low-k structure two-dimensional finite-elements-method (FEM) simulation by ANSYSTM in order to predict the loci of potential failure and identify critical properties of underfill. Excellent correlation was established between the temperature cycling test (TCT) and stress simulation results. The results show that for high lead solder, underfill with low CTE and high modulus is preferred. Finally, the methodologies for characterizing thin-film adhesion such as four-point bending(4PT) and double cantilever beam(DCB) for measuring the fracture energy of interconnect and underfill/passivation interface were reported in this study. Jihperng(Jim) Leu 呂志鵬 2006 學位論文 ; thesis 77 zh-TW
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description 碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === The thermo-mechanical properties of two bisphenol resin-based underfill materials including coefficient of thermal expansion (CTE), glass transition temperature (Tg), hardness (H), Young’s modulus (E), flexure modulus (Ef) and adhesion (Gc) were measured and validated against vendor’s data by differential scanning calorimetry (DSC), thermomechanical analyzer (TMA), nanoindentation (NI), four-point bend (4PT Bending) and double cantilever beam (DCB), respectively. Underfill properties data were then used as the input for calculating the stresses at the bump and Cu-low-k structure two-dimensional finite-elements-method (FEM) simulation by ANSYSTM in order to predict the loci of potential failure and identify critical properties of underfill. Excellent correlation was established between the temperature cycling test (TCT) and stress simulation results. The results show that for high lead solder, underfill with low CTE and high modulus is preferred. Finally, the methodologies for characterizing thin-film adhesion such as four-point bending(4PT) and double cantilever beam(DCB) for measuring the fracture energy of interconnect and underfill/passivation interface were reported in this study.
author2 Jihperng(Jim) Leu
author_facet Jihperng(Jim) Leu
徐元辰
author 徐元辰
spellingShingle 徐元辰
Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
author_sort 徐元辰
title Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
title_short Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
title_full Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
title_fullStr Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
title_full_unstemmed Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
title_sort reliability studies of novel underfill materials for flip-chip packaging
publishDate 2006
url http://ndltd.ncl.edu.tw/handle/33430087621072073702
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