Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
碩士 === 國立交通大學 === 材料科學與工程系所 === 94 === The thermo-mechanical properties of two bisphenol resin-based underfill materials including coefficient of thermal expansion (CTE), glass transition temperature (Tg), hardness (H), Young’s modulus (E), flexure modulus (Ef) and adhesion (Gc) were measured and va...
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| Format: | Others |
| Language: | zh-TW |
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2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33430087621072073702 |