Showing 1 - 6 results of 6 for search 'Jihperng(Jim) Leu', query time: 0.21s Refine Results
  1. 1
    The Effects of Hillock Defect and Stress on the Moisture Resistance of Novel SiOxNy Passivation Layer for OLED Applications
    by Yi-Jen Chen, 陳怡臻
    Published 2008
    Other Authors: “...Jihperng (Jim) Leu...”
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  2. 2
    Evaluation of Mechanical Strength and Bondability of BOAC (Bonding Pad Over Active Circuits) Structures using Nanoindentation
    by Chi-Kao Tang, 湯季高
    Published 2007
    Other Authors: “...Jihperng (Jim) Leu...”
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  3. 3
    Pore Sealing Studies of Porous Silica for Novel Low-K Underfill Materials
    by Guan-Yu Chen, 陳冠宇
    Published 2007
    Other Authors: “...Jihperng (Jim) Leu...”
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  4. 4
    Moisture uptake and diffusion behavior of MSQ/high-temperature porogen hybrids and porous low-k materials
    by Chun-Yuan Teng, 鄧鈞元
    Published 2007
    Other Authors: “...Jihperng (Jim) Leu...”
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  5. 5
    The study of copper thin film resistivity for applications beyond 65nm technology node
    by Zi Hau Fu, 傅子豪
    Published 2006
    Other Authors: “...Jihperng (Jim) Leu...”
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  6. 6
    Reliability Studies of Novel Underfill Materials for Flip-chip Packaging
    by 徐元辰
    Published 2006
    Other Authors: “...Jihperng(Jim) Leu...”
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