Die-Level Interfacial Bonding Strength and Fracture Toughness

• Main Authors: Chi-ming Chen, 陳志明
• Other Authors: Jen ,Ming-Hwa R
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/42718135698923466479

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === It is an important topic for electronic packages to estimate the interfacial bonding strength between dissimilar materials. If it is not strong enough, delamination would arise easily under high temperature, vibration or collision. Its reliability will be reduced. The study on interfacial fracture behavior between epoxy resin and die based on experimental and numerical analyses is investigated, and it is useful to judge where the delamination happens . In terms of interfacial fracture mechanics, the critical strain energy release rate (G ) of crack tip is related to the phase angle (ψ ) . Considering the interface of the epoxy /die existing a tiny crack, the compact mixed mode (CMM) fixture is used to decide the critical load . Finally , we adopt the finite element method to calculate that the critical strain energy release rate (G ) and the phase angle (ψ ) in comparison with empirical results .