Author Search Results

1

Die-Level Interfacial Bonding Strength and Fracture Toughness

by Chi-ming Chen, 陳志明
Published 2004
Other Authors: “...Jen ,Ming-Hwa R...”

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2

Investigation on the mechanical properties of polymer PEEK mixed with silica nanoparticles of different sizes by molecular dynamics simulation

by Ching-ho Shih, 施景賀
Published 2010
Other Authors: “...Jen, Ming-Hwa R....”

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3

Analysis of Deformation on Multi-Layered Ceramic Capacitors due to High Pressure and Elevated Temperature and Wrinkling Phenomenon of Thin Films due to Extension

by Ying-Hui Wu, 吳盈輝
Published 2013
Other Authors: “...Jen, Ming-Hwa R....”

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4

Parametric Study of Solder Ball due to Impact Test

by Tsai-tsung Tao, 蔡宗道
Published 2006
Other Authors: “...Jen, Ming-Hwa R...”

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5

Geometric Shape Prediction for a Sn/4.0Ag/0.5Cu (SAC405) Solder Joint After Reflows

by Kuang-Ting Liu, 劉光庭
Published 2008
Other Authors: “...Jen, Ming-Hwa R....”

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6

Shearing Behavior of Lead Free Solder Bumps

by Chien-Hung Lin, 林建宏
Published 2007
Other Authors: “...Jen, Ming-Hwa R....”

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7

Passive Component Wire Bonding Evaluation in a Hybrid IC Package

by Ying-Chou Chen, 陳盈州
Published 2007
Other Authors: “...Jen, Ming-Hwa R....”

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8

Manufacturing and Mechanical Properties of Centrally Notched AZ31/APC-2 Composite Laminates

by Yen-yen Chiu, 邱岩諺
Published 2007
Other Authors: “...Jen, Ming-Hwa R....”

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9

Reliability of Coreless substrate under thermal loading

by Jhen-Siou Hung, 洪振修
Published 2015
Other Authors: “...Jen, Ming-Hwa R...”

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