Die-Level Interfacial Bonding Strength and Fracture Toughness
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 92 === It is an important topic for electronic packages to estimate the interfacial bonding strength between dissimilar materials. If it is not strong enough, delamination would arise easily under high temperature, vibration or collision. Its reliability will be re...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42718135698923466479 |