A Low-Cost Self-Test Structure for SoC Interconnect Crosstalk Faults
碩士 === 元智大學 === 資訊工程學系 === 91 === With the improvement of process technologies, the spacing between interconnects is getting shorter. The influence of cross-coupling capacitance between adjacent wires becomes serious. The increase of cross-coupling result in crosstalk effects, which are m...
Main Author: | 簡才富 |
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Other Authors: | 曾王道 |
Format: | Others |
Language: | zh-TW |
Published: |
2003
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Online Access: | http://ndltd.ncl.edu.tw/handle/06230836482098523125 |
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