A Low-Cost Self-Test Structure for SoC Interconnect Crosstalk Faults

碩士 === 元智大學 === 資訊工程學系 === 91 === With the improvement of process technologies, the spacing between interconnects is getting shorter. The influence of cross-coupling capacitance between adjacent wires becomes serious. The increase of cross-coupling result in crosstalk effects, which are m...

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Bibliographic Details
Main Author: 簡才富
Other Authors: 曾王道
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/06230836482098523125