Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits

Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits

The main objective of this research is to predict the wirelength, area, delay, and power of multi-granularity three-dimensional integrated circuits (3D ICs), to develop physical design methodologies and algorithms for the design of multi-granularity 3D ICs, and to investigate the impact of through-s...

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Bibliographic Details
Main Author: Kim, Dae Hyun
Published: Georgia Institute of Technology 2012
Subjects:
3D IC
TSV
Through-silicon via
Interconnect
Prediction
Placement
Routing
CAD
Integrated circuits
Interconnects (Integrated circuit technology)
Online Access:http://hdl.handle.net/1853/43642

Internet

http://hdl.handle.net/1853/43642

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