Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers or package-on-package approaches,...

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Bibliographic Details
Main Authors: Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-Ramelow
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Micromachines
Subjects:
fan-out wafer level packaging
panel level packaging
heterogeneous integration
Online Access:https://www.mdpi.com/2072-666X/10/5/342

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https://www.mdpi.com/2072-666X/10/5/342

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