Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging
The flip chip bonding technology is widely used in electronic packaging as a result of improvements towards mechanical performance of layered structures. However, thermal mismatch shear and peeling stress are often induced by the differences of the material properties and geometries of bond layer du...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2017-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/20179501003 |