Material Selection for Interfacial Bond Layer in Electronic Packaging

by Sujan D., Vincent L., Pok Y. W.
Published 2018-01-01

Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly

by Sujan D., Vincent L., Pok Y. W.
Published 2018-01-01

Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author’s Work

by Sujan D., Vincent L., Pok Y. W.
Published 2018-01-01

Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

by Pok Y.W., Sujan D., Rahman M.E., Dol S.S.
Published 2017-01-01