Mechanical characterization of nanostructured thin films at different scales

The mechanical behaviour of multilayered W/Cu thin films on polyimide substrate has been investigated at different scales and using complementary X-ray techniques and compared to finite element analysis. Mechanical testing has been carried out using a new biaxial tensile machine which allows for...

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Bibliographic Details
Main Authors: Chiron R., Randriamazaoro R.N., Goudeau P., Le Bourhis E., Renault P.O., Geandier G., Thiaudière D., Djaziri S., Castelnau O., Faurie D., Hild F.
Format: Article
Language:English
Published: EDP Sciences 2010-06-01
Series:EPJ Web of Conferences
Online Access:http://dx.doi.org/10.1051/epjconf/20100626003