Mechanical characterization of nanostructured thin films at different scales
The mechanical behaviour of multilayered W/Cu thin films on polyimide substrate has been investigated at different scales and using complementary X-ray techniques and compared to finite element analysis. Mechanical testing has been carried out using a new biaxial tensile machine which allows for...
Main Authors: | , , , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
EDP Sciences
2010-06-01
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Series: | EPJ Web of Conferences |
Online Access: | http://dx.doi.org/10.1051/epjconf/20100626003 |