Investigation for the structural stress of SiO2 thin films and its distribution on the large-wafer created by plasma enhanced chemical vapor deposition

Investigation for the structural stress of SiO2 thin films and its distribution on the large-wafer created by plasma enhanced chemical vapor deposition

For a multilayered configuration of SiO2 film created by plasma enhanced chemical vapor deposition (PECVD), the thermal stress and growth-caused stress are two intrinsic stresses. In this work, based on the interactions of all the layers of film, a nonlinearly distributed structural stress over a la...

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Bibliographic Details
Main Authors: DeGui Sun, Qingyu Sun, Wenchao Xing, Zheyu Sun, Hongpeng Shang, Liyuan Chang, Xueping Wang, Peng Liu, Trevor Hall
Format: Article
Language:English
Published: AIP Publishing LLC 2018-08-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5045516

Internet

http://dx.doi.org/10.1063/1.5045516

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