A Study on the Management of a SMC Compound Material Company

by Yung-Fa Chou, 周永發
Published 2014

3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)

by Wen-Wei Shen, Yu-Min Lin, Shang-Chun Chen, Hsiang-Hung Chang, Tao-Chih Chang, Wei-Chung Lo, Chien-Chung Lin, Yung-Fa Chou, Ding-Ming Kwai, Ming-Jer Kao, Kuan-Neng Chen
Published 2018-01-01