A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration

by Yu-Chen Hu, Kuan-Neng Chen
Published 2016-01-01

Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding Technology

by Shih-Wei Lee, Ching-Yun Chang, Geng-Ming Chang, Kuan-Neng Chen
Published 2017-01-01

A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication

by Shih-Wei Lee, Geng-Ming Chang, Ching-Yun Chang, Kuan-Neng Chen
Published 2017-01-01

Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation

by Demin Liu, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, Kuan-Neng Chen
Published 2021-01-01

Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3-D Integration and FOWLP Scheme

by Chuan-An Cheng, Yu-Hsiang Huang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen
Published 2017-01-01

Sake Protein Supplementation Affects Exercise Performance and Biochemical Profiles in Power-Exercise-Trained Mice

by Yi-Ming Chen, Che-Li Lin, Li Wei, Yi-Ju Hsu, Kuan-Neng Chen, Chi-Chang Huang, Chin-Hsung Kao
Published 2016-02-01

3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)

by Wen-Wei Shen, Yu-Min Lin, Shang-Chun Chen, Hsiang-Hung Chang, Tao-Chih Chang, Wei-Chung Lo, Chien-Chung Lin, Yung-Fa Chou, Ding-Ming Kwai, Ming-Jer Kao, Kuan-Neng Chen
Published 2018-01-01