Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications

by Yong‐Sung Eom, Keon‐Soo Jang, Ji‐Hye Son, Hyun‐Cheol Bae, Kwang‐Seong Choi
Published 2019-06-01

Collective laser‐assisted bonding process for 3D TSV integration with NCP

by Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang, Seok Hwan Moon, Hyun‐Cheol Bae, Kwang‐Seong Choi
Published 2019-04-01

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

by Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom
Published 2021-03-01

Self-Powered Autonomous Wireless Sensor Node by Using Silicon-Based 3D Thermoelectric Energy Generator for Environmental Monitoring Application

by Jong-Pil Im, Jeong Hun Kim, Jae Woo Lee, Ji Yong Woo, Sol Yee Im, Yeriaron Kim, Yong-Sung Eom, Won Chul Choi, Jun Soo Kim, Seung Eon Moon
Published 2020-02-01