Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications

by Yong‐Sung Eom, Keon‐Soo Jang, Ji‐Hye Son, Hyun‐Cheol Bae, Kwang‐Seong Choi
Published 2019-06-01

Collective laser‐assisted bonding process for 3D TSV integration with NCP

by Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang, Seok Hwan Moon, Hyun‐Cheol Bae, Kwang‐Seong Choi
Published 2019-04-01

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

by Gwang-Mun Choi, Ki-Seok Jang, Kwang-Seong Choi, Jiho Joo, Ho-Gyeong Yun, Chanmi Lee, Yong-Sung Eom
Published 2021-03-01