Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays

by Tian Qin, Simon J. Bleiker, Sunil Rana, Frank Niklaus, Dinesh Pamunuwa
Published 2018-01-01

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

by Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke, Frank Niklaus
Published 2016-10-01

Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory

by Sunil Rana, João Mouro, Simon J. Bleiker, Jamie D. Reynolds, Harold M. H. Chong, Frank Niklaus, Dinesh Pamunuwa
Published 2020-03-01

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

by Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Goran Stemme, Thorbjorn Ebefors, Frank Niklaus
Published 2018-01-01