Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems

by Frank, Niklaus
Published 2002

Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays

by Tian Qin, Simon J. Bleiker, Sunil Rana, Frank Niklaus, Dinesh Pamunuwa
Published 2018-01-01

Vertical integration of microchips by magnetic assembly and edge wire bonding

by Federico Ribet, Xiaojing Wang, Miku Laakso, Simone Pagliano, Frank Niklaus, Niclas Roxhed, Göran Stemme
Published 2020-02-01

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

by Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke, Frank Niklaus
Published 2016-10-01

Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory

by Sunil Rana, João Mouro, Simon J. Bleiker, Jamie D. Reynolds, Harold M. H. Chong, Frank Niklaus, Dinesh Pamunuwa
Published 2020-03-01

Massively parallel fabrication of crack-defined gold break junctions featuring sub-3 nm gaps for molecular devices

by Valentin Dubois, Shyamprasad N. Raja, Pascal Gehring, Sabina Caneva, Herre S. J. van der Zant, Frank Niklaus, Göran Stemme
Published 2018-08-01

Flexible and Stretchable Microneedle Patches with Integrated Rigid Stainless Steel Microneedles for Transdermal Biointerfacing.

by Mina Rajabi, Niclas Roxhed, Reza Zandi Shafagh, Tommy Haraldson, Andreas Christin Fischer, Wouter van der Wijngaart, Göran Stemme, Frank Niklaus
Published 2016-01-01

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

by Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Goran Stemme, Thorbjorn Ebefors, Frank Niklaus
Published 2018-01-01

Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development

by A. D. Smith, Qi Li, Agin Vyas, Mohammad Mazharul Haque, Kejian Wang, Andres Velasco, Xiaoyan Zhang, Shameel Thurakkal, Arne Quellmalz, Frank Niklaus, Kristinn Gylfason, Per Lundgren, Peter Enoksson
Published 2019-09-01

Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

by Arne Quellmalz, Xiaojing Wang, Simon Sawallich, Burkay Uzlu, Martin Otto, Stefan Wagner, Zhenxing Wang, Maximilian Prechtl, Oliver Hartwig, Siwei Luo, Georg S. Duesberg, Max C. Lemme, Kristinn B. Gylfason, Niclas Roxhed, Göran Stemme, Frank Niklaus
Published 2021-02-01

Nanoelectromechanical Sensors Based on Suspended 2D Materials

by Max C. Lemme, Max C. Lemme, Stefan Wagner, Kangho Lee, Xuge Fan, Gerard J. Verbiest, Sebastian Wittmann, Sebastian Lukas, Robin J. Dolleman, Frank Niklaus, Herre S. J. van der Zant, Georg S. Duesberg, Peter G. Steeneken, Peter G. Steeneken
Published 2020-01-01