Monolithic Integration of Si-CMOS and III-V-on-Si Through Direct Wafer Bonding Process

by Kwang Hong Lee, Yue Wang, Bing Wang, Li Zhang, Wardhana Aji Sasangka, Shuh Chin Goh, Shuyu Bao, Kenneth E. Lee, Eugene A. Fitzgerald, Chuan Seng Tan
Published 2018-01-01