EFFECT ON MICROSTRUCTURAL AND PHYSICAL PROPERTIES OF Sn-3.0Ag-0.5Cu LEAD-FREE SOLDER WITH THE ADDITION OF SiC PARTICLES

by Zawawi MAHIM, Mohd Arif Anuar MOHD SALLEH, Norainiza SAUD
Published 2019-03-01

The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint

by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud, Marcin Nabiałek
Published 2021-02-01

Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

by Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Mohd Mustafa Al Bakri Abdullah, Norainiza Saud, Shayfull Zamree Abd Rahim, Petrica Vizureanu, Rita Mohd Said, Mohd Izrul Izwan Ramli
Published 2021-02-01

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

by Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Siti Farahnabilah Muhd Amli, Rita Mohd Said, Norainiza Saud, Mohd Mustafa Al Bakri Abdullah, Petrica Vizureanu, Adam Rylski, Jitrin Chaiprapa, Marcin Nabialek
Published 2021-09-01